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thinkRF - RF Spectrum Analyzer
Market disrupting 27 GHz spectrum analyzer
An Inside Glimpse Into the Product Development of ThinkRF's Spectrum Analyzer
Background & Design Requirements
ThinkRF came to Design 1st to develop a robust heat-dissipating enclosure that would both safely hold the custom electronics and create a unique, branded design.
- Develop multiple design concepts, including a modular stacking frame
- Meet regulatory standards and dissipate heat to prevent any thermal issues during usage
- Create a low-volume run of functional prototypes for user testing in real environments
Engineering Challenges
Implementing Design 1st’s proven product development process, the team overcame several obstacles to deliver the industry-leading spectrum analyzer device.
- Develop an optimized heatsink enclosure design to maintain required device operating temperature
- Build a virtual 3D model for simulation testing to understand wireless, heat, and air flow properties
- Built multiple design concepts using CNC Machining for real-world user testing of the device
Product Design Results
Through creativity and technical understanding, the Design 1st team developed an award-winning product that continues to be the #1 global selling spectrum analyzer.
- Develop and test a fully functioning unit in under six weeks to exploit market opportunity.
- Mount the custom PCB’ s on heat spreader plates cooled by thermal convection.
- Develop multiple variants of RF cable connector design to optimize user experience.
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